THERMALLY CURED GAP FILLING DIELECTRIC
- Used to Fill High Copper Inner Layers to Achieve a Planar Outer Layer
- Screen Print Application with Flame Resistant Properties
- UL Listed
- High Tg (160°C) and Low CTE (32/115 ppm)
- 100% Solids for Extremely Low Shrinkage and Ease of Planarization
- No Chemical Attack through Desmear
- Halogen Free
- Excellent Adhesion between Layers
- RoHS Compliant
- Compatible with Lead-Free Processing
| PRODUCT NAME: THP-100 DX1 (GF) UL NAME: THP-100GF | PRODUCT DESCRIPTION: Thermally Cured Gap Filling Dielectric |
MANUFACTURER’S NAME : TAIYO AMERICA, INC. 2675 Antler Drive Carson City, NV 89701 U.S.A. | EMERGENCY CONTACT: SDS Info SDSinfo@taiyo-america.com 775-885-9959 ext. 1135 |