Printed Circuit Boards

PHOTOIMAGEABLE HOLE FILL MATERIAL

• Photoimageable, Two Component Hole Fill
• Green Color
• Low Shrinkage
• For Plated or Non-Plated Holes
• Compatible with Solder Mask Top Coats
• RoHS Compliant
• Compatible with Lead-Free Processing
• Wide Processing Window
• Resistance to Final Finishes

SILVER CONDUCTIVE HOLE FILL MATERIAL

• Conductive Silver, Single Component Hole Fill
• Silver Color
• Excellent Screening Characteristics to Fill Holes
• Excellent Thermal Conductivity
• Good Reliability and Compatibility with Copper Plating
• RoHS Compliant
• Compatible with Lead-Free Processing 

THERMALLY CURED GAP FILLING DIELECTRIC

• Used to Fill High Copper Inner Layers to Achieve a Planar Outer Layer
• Screen Print Application with Flame Resistant Properties
• UL Listed
• High Tg (160°C) and Low CTE (32/115 ppm)
• 100% Solids for Extremely Low Shrinkage and Ease of Planarization
• No Chemical Attack through Desmear
• Halogen Free
• Excellent Adhesion between Layers
• RoHS Compliant
• Compatible with Lead-Free Processing 

PERMANENT HOLE FILL MATERIAL

• Designed Specifically for Hole Filling Equipment to Fill Small Vias without Voids
• Available in Cartridges and 1.3 Kg Cans 
• High Tg and Low CTE 
• Very Low Shrinkage and Ease of Planarization 
• No Chemical Attack through Desmear 
• Halogen-Free and RoHS Compliant 
• High PCT and Thermal Resistance

PERMANENT HOLE FILL MATERIAL

• Available in a 1 and 5 kg Containers 
• One-Component  
• Very Low Shrinkage 
• RoHS Compliant 
• High PCT and Thermal Resistance 
• Halogen-Free

UV CURABLE HOLE FILL MATERIAL

• UV Cure, Single Component Hole Fill
• Light Green Color
• Low Shrinkage with 100% Solids
• For Plated or Non-Plated Holes
• Compatible with Solder Mask Top Coats
• RoHS Compliant
• Compatible with Lead-Free Processing
• Wide Processing Window
• Resistance to Final Finishes